Warp Analysis

Cascade Engineering

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Flow Analysis | Cooling Analysis | Warp Analysis | Advanced Capabilities

We can analyze differential shrinkage due to pack pressures, differential cooling due to mold surface temperatures based on cooling circuit design, and the molecular orientation effects on part warpage.

	These lid animations are two different views of the same warpage result. This result is a Z deflection animation from zero to 100% loading and represents the net shape of the part after part ejection due to molding. Our goal here is to make a flat part that seals on the mating cart. We optimize the gate locations and process conditions to reduce the three main factors causing warpage. Results are shown 20X actual deflection.


	Three different gating scenarios are compared relative to the “Z” out of plane warpage for this large 28-inch diameter part. The performance of this product requires the flatness in the “Z” direction to have a tolerance of +/- 0.040”. This flatness objective was achieved by changing the quantity and location of drops in order to reduce orientation effects on warpage. Evolution of the drop locations is shown at the left as part warpage was reduced from initial tool conception to final tool design. Actual parts from the mold trial proved the warpage analysis to be a success as the parts met the flatness tolerance.


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